MHF1-2

Material:

1. Contact: Copper alloy, Brass per JIS C2680 or other equivalent copper alloy.
2. Ground contact: Copper alloy, Ph. Bronze per JIS C5191 or other equivalent.
3. Housing: LCP resin with 30% G.F. 血ed, UL94v-O.
4. Finish: (plating thickness)
   Contact :Au plating over 50u" Nickel under plating.
   Ground contact: Au flash over 50u" Nickel under plating.
   Or Ag lOOu" over lOu" Nickel under plating.