• Material:

    1. Contact: Copper alloy, Brass per JIS C2680 or other equivalent copper alloy.
    2. Ground contact: Copper alloy, Ph. Bronze per JIS C5191 or other equivalent.
    3. Housing: LCP resin with 30% G.F. filled, UL94v-0.
    4. Finish:
      Contact : Gold 0.025um (1 u") mini over 1.27 um (50 u") Nickel under plating.
      Ground contact: Gold flash over 1.27 um (50 u") Nickel under plating.

     

    YMU0701010

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