• MHF1-2

    Material:

    1. Contact: Copper alloy, Brass per JIS C2680 or other equivalent copper alloy.
    2. Ground contact: Copper alloy, Ph. Bronze per JIS C5191 or other equivalent.
    3. Housing: LCP resin with 30% G.F. 血ed, UL94v-O.
    4. Finish: (plating thickness)
      Contact :Au plating over 50u" Nickel under plating.
      Ground contact: Au flash over 50u" Nickel under plating.
      Or Ag lOOu" over lOu" Nickel under plating.
    YMX067XXXX
    YMX0681XXX
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